PCB RELEASED TECHNOLOGIES

Reliability Laboratory

Insulation/Corrosion
resistance/Conductif
Anodic Filament (CAF test)

Ion migration evaluation system Espec AMI

Test Voltage : 500 V
Number of channels : 100 Channels ( advanced 150 Channels)

Thermal shock (air to air)

  • Thermal Cycling Chamber Espec TSD 100
  • Temperature range :
    • Hot : +60°C -> +200°C
    • Low : -65°C->0°C
  • Volume : 100L

Value Proposition

fuba-value-proposition

Tests that can be performed at Fuba

  • Thermal Shock (Thermal Cycling Air to Air)
  • Temperature & Humidity test
  • Insulation Resistance/Corrosion test/ CAF
  • Optical inspection
  • Peel Strength test
  • Adhesion of the soldermask (grid cut test)
  • Solder heat resistance (solderability test)
  • Voltage test
  • Viscosity measurement
  • Gel time
  • DSC – Differential Scanning Calorimetry
  • X-ray: Coating thickness measurement
  • Surface Ionic Contamination (Rose method)
  • Roughness measurement
  • Copper thickness in PTH
  • UV-Vis spectrophotometry
  • Atomic Absorption Spectroscopy
  • Thermal Storage & Aging

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